MB GIGABYTE B650 EAGLE AX DDR5 AM5

MB GIGABYTE B650 EAGLE AX DDR5 AM5

د.ا160.00

  • AMD Socket AM5：Supports AMD Ryzen™ 7000/ Ryzen™ 8000/ Ryzen™ 9000 Series Processors
  • Unparalleled Performance：12+2+2 Phases Digital VRM Solution
  • Dual Channel DDR5：4*SMD DIMMs with AMD EXPO™ & Intel® XMP Memory Module Support
  • SuperSpeed Storage：1*PCIe 5.0 + 2*PCIe 4.0 M.2 Connectors
  • Advanced Thermal Design & M.2 Thermal Guard：To Ensure VRM Power Stability & 25110 M.2 SSD Performance
  • EZ-Latch：PCIe x16 Slot with Quick Release Design
  • Fast Networks：Wi-Fi 6E 802.11ax & GbE LAN
  • Extended Connectivity：DP, HDMI, Rear USB® 10Gb/s
  • Smart Fan 6：Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
  • Q-Flash Plus：Update BIOS Without Installing the CPU, Memory and Graphics Card
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OVERVIEW

  • 8 Solid Pin CPU Power Connector

  • 6*USB 2.0

  • Wi-Fi 6E 802.11ax

  • 1*DisplayPort / 1*HDMI

  • 2*USB 3.2 Gen 2+ 1*USB 3.2 Gen 1 Type-C®

  • GbE LAN

  • Advanced Thermal Design

    • Fully Covered MOSFET Heatsinks
    • 5 W/mk Thermal Conductivity Pad
    • Integrated I/O Shield

  • 3*M.2 Ultra Storage Performance Connectors

    • 1*PCIe 5.0+2*PCIe 4.0 M.2
    • 1*M.2 Thermal Guard

  • Hi-Fi Audio

    • 8-Ch HD Audio
    • Audio Noise Guard
    • High-End Audio Capacitor

  • 12+2+2 Digital VRM Design

    • 6-Layer PCB
    • PCIe 5.0 Ready Mid-Loss PCB

  • Socket AM5 Supports
    AMD Ryzen™Series Processors

  • 24 Pin ATX Power Connector

  • Dual Channel SMD DDR5 Memory

  • Front USB 3.2 Gen 1

  • Smart Fan 6

    • 5*PWM/DC Fan Headers
    • Dual Fan Curve Mode

  • Front USB 3.2 Gen 1 Type-C®

  • PCIe EZ-Latch

  • 4*SATA 6Gb/s

  • RGB FUSION

    • 3*Addressable LED Header
    • 1*RGB LED Header

EXPO & XMP Support

DDR5 EXPO & XMP Overclocking Up to 8000 and Beyond*

GIGABYTE is offering a tested and proven platform with extreme memory performance boost.

* Memory overlocking and XMP profile support may vary depending on hardware configuration.
* Please see the complete validated memory support list.
Product features may vary by model.

Shielded Memory Routing

All memory routing is under the PCB inner layer shielded by a large ground layer to protect from external interference.

EXPO & XMP Support

Unlock DDR5 Voltage

GIGABYTE Exclusive DDR5 Circuit Design Increases DDR5 memory overclocking performance and capability by transforming Native DDR5 memory module to Overclocked DDR5 memory.

Secure Mode

MB provides fixed 5V to Native DDR5 memory and built-in PMIC outputs locked 1.1v to memory IC.

  • Unlocks Native DDR5 PMIC secure mode into programmable mode and controls Native DDR5 voltage with wide range.
  • Supports all PMIC vendors for maximum compatibility

    • * Memory overclocking capabiblity will vary based on users’ hardware configuration

EXPO & XMP Support

Maximum Compatibility for Memory O.C

GIGABYTE AM5 MB supports both AMD EXPO™ and Intel® XMP overclocking memory modules for maximal compatibility. MB will automatically detect both profiles format in SPD, users can choose to enable one of profiles from BIOS menu and easily reach overclocked memory performance.

EXPO & XMP Support

DDR5 Auto Booster

Automatically Boost the Native DDR5 frequency to 5000MHz while the system is under heavy loading by a single click.

EXPO & XMP Support

AMD EXPO™ and Intel® XMP 3.0 User Profile

Easily create overclocked memory performance by defining and creating your own SPD profile into Native and XMP 3.0 memory modules, or applying the pre-tuned profiles to XMP 3.0 User Profile.

– Performance Simulation:

  • based on user input clock and timing parameters

– User-defined profile can be:

  • – saved and cleared
  • – loaded either locally or from/to an external storage device
  • – carried to next computer
  • – share your memory parameters online

Thermal

Fully Covered MOSFET Heatsink
3X Large Surface
Increased surface area up to 3X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.

Real One-piece Build
TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design.

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